1¡^Applied in semiconductor wafer¡¦s cleaning and etching;¡@
¡@¡@ 2¡^Process flow:Designed as customer required,used in cleaning,etching,plating,stripping,polishing and etc.
3¡^Control mode: Manual,semi-auto,Auto.;
4¡^Material:Depending on process and customer requirement,available matierials eg.PP,PVC,PVDF,Quartz Tube,Stainless steel and others;
Features and benefits:
Ć A. Module design;Depending on customer requriment and process,offer special solution;
B. Customization based on customer budget;
C. Optimum wet cleaning solution;
D. High PPR;
E.Various options available:;
F. Operator friendly and safe;
G. Easy maintenance;