Bonding machine for LCD Refurbishment XCM71 - A5 FOG/FOB bonding machines£¬ bonding equipment£¬ bonding machine£¬ FOB bonding machine£¬ bonder machine£¬ bonder equipment£¬ 1. About the application field of FOG/FOB bonding equipment XCM71 - A5 FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as£¬ television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises. 2.About the basic parameters of FOG/FOB bonding equipment XCM71 -A5 Input Power£¬ AC220V 50-60Hz Working pressure £¬0.4-0 .8 Mpa Operating modes£¬ 7-inch HMI Dimensions£¬ L2210 × W1730 × H1500 mm The method of Heating£¬ heating or pulse heating thermostat The quantity of Fixture£¬ 2 group X-Y-¦È micrometer adjustable Range of Temperature £¬ RT-500 Control program£¬ PLC controller Body main material£¬ Steel + baking varnish The thermocouple£¬ K type 3.About the functions and characteristics of the FOG/FOB bonding equipment XCM71 - A5 3.1use pneumatic components of Japan SMC and high-precision the moving parts 3.2 use temperature controller of Japan and The function module of the integral PID self-tuning temperature,accurate temperature. 3.3 Imported PLC control£¬the operation of 7-inch full-color touch-screen 3.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.