Underfill Epoxy

Quantity :
0
Sample Price :
On Demand
Payment Terms :
Letter of Credit
Price Valid Till :
Dec,31, 2020

The underfill epoxy is designed with good flow and capillary properties that can fill the area between the die and the carrier. Once cured, it helps to absorb the stress exerted on the solder bumps. It gives strong adhesion and improves the mechanical integrity to ensure long term reliability.

Company Profile

Penchem designs and manufactures advanced materials especially for the electronic and automotive industries,Penchem designs and manufactures advanced materials especially for the electronic and automotive industries.