Surface Grinding Machine for Sapphire

Quantity :
0
Sample Price :
On Demand
Payment Terms :
Letter of Credit
Price Valid Till :
Dec,31, 2020

The silicon and sapphire Lapping machine are mainly used for the grinding and polishing of sapphire substrate, silicon, optical glass, and other semiconductors, sapphire wafers in particular. We have quite mature processing technique, and full series of Equipments. 16B double side Grinding machine(16B LAPPING), 16B double side lapping machine(16B CMP), 36 inch single side copper lapping machine(36G DMP), 36 inch single side chemical lapping machine(36G CMP).

Company Profile

BE-STAR Machinery Technology Co., Ltd. Is the worldwide leading supplier for its technology in wire manufacturing and silicon cutting, which are mainly applied to industries including PV cell cutting wire, steel radial tire cord, silicon slice, and special rare metal wire