Quantity :
Sample Price :
On Demand
Payment Terms :
Letter of Credit
Price Valid Till :
Dec,31, 2023

APPLICATIONS Complete erasing of charges of EPROM and Flash memory. UV Curing and Hardening. Removal of stress induce due to manufacturing processes. FEATURES: 300mm ready Class 10 cleanliness Modular design for future expansion Capable of handling thin wafer GEM full compliance Wafer sort - FOUP to FOUP or FOUP to FOSB

Company Profile

The Company provides printed circuit board and box-build assembly, equipment design and manufacturing services. It is well equipped to provide value-added services such as materials management, circuit layout, prototype & development engineering, metal stamping and precision machined components. The Company serves customers in the industrial equipment market segment. These include electro-luminescent displays used in industrial, transportation and medical applications, medical and health care equipment; office equipment as in digital photocopiers, analytical instruments as in gas and liquid chromatographs and measurement instruments, industrial safety controllers and environmental sensors, front and back end semiconductor equipment and SMT equipment.